Contact: Victor Chan
E-mail: info@electronics-trading.com
Tel/fax: (852) 22320623/23140048
Direct Line: (852) 23140038
Maintenance Service Hot Line: (852) 23140038
Free on line enquiry by Skype: victor3268
Room D, 15/F., Thomson Commercial Bldg,
8 Thomson Road, Wan Chai, H.K.
Secondary E-mail address: smt@electronics-trading.com
Secondary Fax : (852) 28610809
Ultra high-resolution semi-automatic nanofocus
X-ray system for the inspection of high-end interconnection technology in the semiconductor and SMT industry, with the option of combined 2D/3D operation.
Main Specifications --- PDF & Video Demo
| System Magnification and | ||
|---|---|---|
| Resolution | ||
| Geometric magnification | up to 2,130 x | |
| Total magnification | up to 13,300 x | |
| Detail detectability | down to 200 nm (0.2 microns) with nanofocus™ tube | |
| Contrast resolution | down to 0.5 % | |
| X-ray tube | ||
| Maximum tube voltage | up to 160 kV | |
| Maximum tube power | up to 50 W | |
| Dose rate stability | < 0.5 % / 8 h | |
| Manipulator | ||
| X-Y scanning area | 610 mm x 510 mm (24" x 20") | |
| Maximum sample weight | 5 kg (11 lbs.) | |
| ovhm -oblique view at highest magnification | view angle up to 70°, rotation 0° - 360° | |
| Control | joystick control (manual mode) and CNC (automatic mode) | |
| Axis speed (X-Y-Z) | 10 micron/s to 80 mm/s | |
| Manipulation aids | sample X-ray mapping, click'n-move-to function, click'n-zoom-to function, | |
| automatic isocentric manipulator movement, laser crosshair | ||
| ACS -Anti-Collision System | may be deactivated for maximum magnification | |
| Image processing | ||
| quality|assurance | comprehensive X-ray inspection software comprising | |
| (for details see separate data sheet) | image enhancement functions, measuring functions and CNC inspection program | |
| ming for semi-automatic inspection | ||
| Radiation Safety | ||
| Safety Cabinet | steel with lead shield, lead glass, leakage radiation < 1 µSv / h | |
nanome|x
Ultra high-resolution nanofocus
|
||
|---|---|---|
| X-ray system for the inspection of | ||
| high-end interconnection technology | ||
| in the semiconductor and SMT | ||
| industry. | ||
| System Dimensions | ||
| Dimensions (W x H x D) | 2020 mm x 1920 mm x 1860 mm (80" x 76" x 73") | |
| (without console, including 300 mm demountable back side extension) | ||
| Height adjustable control panel (D) | 500 mm (19.5") | |
| Weight | appr. 2600 kg (5720 lbs.) | |
| Configurations | ||
| Unique options | ||
| X-ray performance monitoring | target check, focus check, resolution test | |
| Software options | ||
| bga|module | for automatic BGA solder-joint evaluation incl. automatic wetting analysis | |
| qfp|module | for automatic QFP solder-joint evaluation incl. automatic wetting analysis | |
| vc|module | automatic voiding calculation software package | |
| ws|module | automatic wire sweep software module | |
| repair|module | visual interface for rework and failure indication | |
| X-ray tube | ||
| General | ||
| Type | open tube, transmission head, 170° cone angle, collimated | |
| Target | tungsten on Be-free support | |
| Filament | tungsten hairpin, pre-adjusted in plug-in cartridges | |
| Vacuum system | oil-free turbo-molecular and roughing pump | |
| High-power nanofocus™ tube | ||
| Voltage / power | 160 kV / 50 W | |
| Detail detectability | 200 - 300 nm | |
| Dual-mode nanofocus™ tube | ||
| Voltage / power | 100 kV / 160 kV / 20 W | |
| Detail detectability | 200 - 300 nm / 100 kV - 1 µm / 160 kV | |
| Detector | ||
| Digital image chains for enhanced | full digital imaging with: highly resolving 4" dual-field image intensifier, | |
| and superior resolution | 12-bit 1k x 1k digital camera and 17" TFT display | |
| high-contrast|set for superior contrast | 16-bit digital a-Si diode array detector with Lanex® scintillator foil plus 16-bit | |
| quality|assurance software for superior contrast resolution at 65,000 shades of grey | ||
| 2/3 | ||
nanome|x
Ultra high-resolution nanofocus
X-ray system for the inspection of high-end interconnection technology in the semiconductor and SMT industry.
Manipulation
ovhm|module 70 0° -70° oblique view at highest magnification dual-ovhm|module 70 oblique view at highest magnification 0° -70° with both high-contrast detector and image chain, switching by software Tilt/Rotate unit tilt ± 30° and rotation n x 360° for samples up to 2 kg
CT ability (option)
| Upgrade package for combined 2D / 3D (computed tomography) operation, | |
|---|---|
| comprising precision mechanics, high-contrast|detector plus SIXTOS reconstruction | |
| software (see v|tome|x brochure) | |
| Volume reconstruction / acquisition software | SIXTOS |
| Acquisition time | 10 minutes for 500 projections (depending on selected detector integration time) |
| Reconstruction time | 12 minutes (2563 Voxels) to 48 minutes (5123 Voxels), parallel to data acquisition |
| Algorithm | optimised filtered back-projection (Feldkamp type) |
| Resolution | down to 2 µm |
| Maximum geometric magnification (CT) | 200 x |
| Visualisation software | Volume Graphics Studio Max, see brochure |